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Semiconductor Process
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Semiconductor Process
Thermal Evaporator & Glove Box Integration System (Thermal Evaporator & Glove Box)
# Jiaotong University Campus, Thermal Evaporator + Glove Box (TEG), only open to entrusted operation, fee-based use, instrument location: Room R224, Nano Center
Flip-chip Bonder
# Jiaotong University Campus, Smart Equipment Technology (SET), ACCμRA 100, only open for commissioned operation, chargeable use, instrument location: Room R135, Nano Center
Multi-cavity magnetron plasma thin film system Sputter C
# Jiaotong University Campus, KD-Sputter-Load luck, commissioned operation, chargeable use, instrument location: Nano Center 3F Room 304 (clean room)
Related Instruments
- Core Facility of Basic Research of National Science Council | Three or Five Molecular Beam Epitaxy System
- National Science Council Basic Research Core Facility | LightHood Production System/Graphic Production System
- National Science Council Basic Research Core Facility | Mask Alignment Exposure Machine
- National Science Council Basic Research Core Facility | Oxidation Diffusion System
- National Science Council Basic Research Core Facility | Low Pressure Chemical Vapor Deposition System
- National Science Council Basic Research Core Facility | Plasma Assisted Chemical Vapor Deposition System (PECVD)
- National Science Council Basic Research Core Facility | Dielectric Material Reactive Ion Etching System (RIE-400iP, RIE-200L, P5000E)
- National Science Council Basic Research Core Facility | Conductive Material Reactive Ion Etching System (RIE-10N, HDP-RIE, Si Deep-RIE)
- National Science Association Basic Research Core Facilities | Thermal Evaporation System
- National Science Association Basic Research Core Facilities | Atomic Layer Deposition System
- National Science Council Basic Research Core Facility | High Vacuum Coating System